Semiconductor device

ABSTRACT

An object of the present invention is to provide a technique capable of reducing a gap between a first semiconductor device and a second semiconductor device that are bonded. At least one of a pair of a first electrode of the first semiconductor device and a second electrode of the second semiconductor device and a pair of a second electrode of the first semiconductor device and a first electrode of the second semiconductor device is electrically connected, and for each of the first semiconductor device and the second semiconductor device, each of a thickness of a portion from a first connected portion to a second connected portion and a thickness of a holding member are equal to or less than a thickness of a first main body portion or a thickness of a second main body portion.

TECHNICAL FIELD

The present invention relates to a semiconductor device.

BACKGROUND ART

In a semiconductor device such as a power semiconductor device or the like, a technique in which a plurality of modules each having one arm are prepared and bonded to configure one module having a plurality of arms has been proposed (for example, Patent Document 1). Note that one module having one arm may also be referred to as a single function module, a single-phase module, a 1-in-1 module, or the like. One module having a plurality of arms may be, for example, a 2-in-1 module, a 6-in-1 module, or the like. According to the technique such as is disclosed in the above-described Patent Document 1, the semiconductor device can be miniaturized.

PRIOR ART DOCUMENT Patent Document

-   Patent Document 1: Japanese Patent Application Laid-Open No.     2013-038105

SUMMARY Problem to be Solved by the Invention

However, in the prior art, since an entire sealing member holding a semiconductor element is relatively thick, a gap is created between electrodes of the plurality of bonded single function modules. As a result, there was a problem in which ease of assembly and miniaturization of the semiconductor device are reduced.

Thereupon, the present disclosure has been made in view of the above problems, and an object thereof is to provide a technique capable of reducing a gap between a first semiconductor device and a second semiconductor device that are bonded.

Means to Solve the Problem

A semiconductor device according to the present disclosure includes a first semiconductor device and a second semiconductor device capable of being bonded, in which each of the first semiconductor device and the second semiconductor device includes a semiconductor element, a first electrode having a first connected portion disposed on a first side in a vertical direction, which is a bonding direction of the first semiconductor device and the second semiconductor device, with respect to the semiconductor element, and connected to the semiconductor element, and a first main body portion disposed laterally of the semiconductor element and connected to the first connected portion, a second electrode having a second connected portion disposed on a second side in the vertical direction with respect to the semiconductor element and connected to the semiconductor element, and a second main body portion disposed laterally of the semiconductor element and connected to the second connected portion, and a holding member that holds the semiconductor element, the first electrode, and the second electrode, and exposes a surface of the first electrode on the first side and a surface of the second electrode on the second side, at least one of a pair of the first electrode of the first semiconductor device and the second electrode of the second semiconductor device, and a pair of the second electrode of the first semiconductor device and the first electrode of the second semiconductor device, is electrically connected, and for each of the first semiconductor device and the second semiconductor device, each of a thickness of a portion from the first connected portion to the second connected portion and a thickness of the holding member are equal to or less than a thickness of the first main body portion or a thickness of the second main body portion.

Effects of the Invention

According to the present disclosure, at least one of a pair of a first electrode of a first semiconductor device and a second electrode of a second semiconductor device and a pair of a second electrode of the first semiconductor device and a first electrode of the second semiconductor device is electrically connected, and for each of the first semiconductor device and the second semiconductor device, each of a thickness of a portion from a first connected portion to a second connected portion and a thickness of a holding member are equal to or less than a thickness of a first main body portion or a thickness of a second main body portion. According to such a configuration, it is possible to reduce a gap between the first semiconductor device and the second semiconductor device that are bonded.

Objects, features, aspects, and advantages of the present disclosure will become more apparent from the following detailed description and the accompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross-sectional view illustrating a configuration of a semiconductor device according to a first embodiment.

FIG. 2 is a plan view illustrating a configuration of a first semiconductor device according to the first embodiment.

FIG. 3 is a cross-sectional view illustrating a configuration of a first semiconductor device according to the first embodiment.

FIG. 4 is a side view illustrating a configuration of the first semiconductor device according to the first embodiment.

FIG. 5 is a plan view illustrating a configuration of a second semiconductor device according to the first embodiment.

FIG. 6 is a cross-sectional view illustrating a configuration of a second semiconductor device according to the first embodiment.

FIG. 7 is a side view illustrating a configuration of a second semiconductor device according to the first embodiment.

FIG. 8 is a cross-sectional view illustrating a configuration in which one first semiconductor device and one second semiconductor device are bonded according to the first embodiment.

FIG. 9 is a side view illustrating a configuration in which one first semiconductor device and one second semiconductor device are bonded according to the first embodiment.

FIG. 10 is a cross-sectional view illustrating a configuration in which two first semiconductor devices and one second semiconductor device are bonded according to the first embodiment.

FIG. 11 is a cross-sectional view illustrating configurations of a first semiconductor device and a second semiconductor device according to a second embodiment.

FIG. 12 is a cross-sectional view illustrating configurations of a first semiconductor device and a second semiconductor device according to a third embodiment.

FIG. 13 is a plan view illustrating a configuration of a second semiconductor device according to a fourth embodiment.

FIG. 14 is a cross-sectional view illustrating a configuration of a semiconductor device according to a ninth embodiment.

FIG. 15 is a cross-sectional view illustrating a configuration of a semiconductor device according to a tenth embodiment.

FIG. 16 is a cross-sectional view illustrating a configuration of a first semiconductor device according to a thirteenth embodiment.

FIG. 17 is a plan view illustrating a configuration of the first semiconductor device according to the thirteenth embodiment.

FIG. 18 is a cross-sectional view illustrating a configuration of a semiconductor device according to a fourteenth embodiment.

FIG. 19 is a cross-sectional view illustrating a configuration of a semiconductor device according to a fifteenth embodiment.

DESCRIPTION OF EMBODIMENTS

Hereinafter, embodiments will be described with reference to the accompanying drawings. Features described in each of the following embodiments are examples, and not all features are necessarily essential. Furthermore, in the following description, similar constituent elements in a plurality of embodiments are denoted by the same or similar reference numerals, and different constituent elements will mainly be described. In addition, in the following description, a specific position and direction, such as “upper”, “lower”, “left”, “right”, “front”, or “back” may not necessarily coincide with a direction during actual implementation.

First Embodiment

FIG. 1 is a cross-sectional view illustrating a configuration of a semiconductor device according to a first embodiment. The semiconductor device according to the first embodiment includes a first semiconductor device 1 and a second semiconductor device 2 capable of being bonded, greases 60 a, 60 b, 60 c, and 60 d, insulating plates 70 a and 70 b, and cooling fins 80 a and 80 b.

As will be described in detail later, each of the first semiconductor device 1 and the second semiconductor device 2 according to the first embodiment is a 2-in-1 module. Therefore, the semiconductor device in FIG. 1 in which one first semiconductor device 1 and one second semiconductor device 2 are bonded is a 4-in-1 module. Hereinafter, the invention will be described with a bonding direction of the first semiconductor device 1 and the second semiconductor device 2 being a vertical direction, and a lateral corresponding to a direction orthogonal to the vertical direction.

The insulating plate 70 a is disposed on an upper surface, which is a first side in the vertical direction, of the first semiconductor device 1 and the second semiconductor device 2 bonded, via the grease 60 a. The cooling fin 80 a is disposed on the upper surface of the insulating plate 70 a via the grease 60 b.

The insulating plate 70 b is disposed on a lower surface, which is a second side in the vertical direction, of the first semiconductor device 1 and the second semiconductor device 2 bonded, via the grease 60 c. The cooling fin 80 b is disposed on the lower surface of the insulating plate 70 b via the grease 60 d.

Note that in FIG. 1 , the greases, the insulating plates, and the cooling fins are disposed on each of the upper surface and the lower surface of the first semiconductor device 1 and the second semiconductor device 2, however the greases, the insulating plates, and the cooling fins may be disposed on one of the surfaces only.

FIG. 2 is a plan view illustrating a configuration of the first semiconductor device 1 according to the first embodiment, FIG. 3 is a cross-sectional view illustrating the configuration, and FIG. 4 is a side view illustrating the configuration. Specifically, FIG. 2(a) is a plan view of the first semiconductor device 1 as viewed from the upper surface, and FIG. 2(b) is a plan view of the first semiconductor device 1 as viewed from the lower surface. FIG. 3 is a cross-sectional view along line A-A of FIG. 2(a). FIG. 4(a) is a side view as viewed from a direction B in FIG. 2(a), and FIG. 4(b) is a side view as viewed from a direction C in FIG. 2(a).

As illustrated in FIG. 2 , the first semiconductor device 1 includes a P main electrode 12, an N main electrode 13, and a sealing member 15, and as illustrated in FIG. 3 , it includes semiconductor elements 11 a and 11 b, an output terminal 14, and brazing materials 16 a, 16 b, 16 c, and 16 d.

The semiconductor elements 11 a and 11 b include, for example, at least one of a semiconductor switching element and a diode of a power semiconductor element. The semiconductor switching element is, for example, an insulated gate bipolar transistor (IGBT), a metal oxide semiconductor field effect transistor (MOSFET), or the like. The diode is, for example, a Schottky barrier diode (SBD), a PN junction diode (PND), or the like. Furthermore, in the first embodiment, the number of semiconductor elements 11 a and 11 b is two, however the present invention is not limited hereto.

The P main electrode 12, which is a first electrode, is formed of a conductor such as aluminum (Al) or copper (Cu) and as illustrated in FIG. 2(a), has a P connected portion 12 a, which is a first connected portion, and a P main body portion 12 b, which is a first main body portion. As illustrated in FIG. 3 , the P connected portion 12 a is disposed on the upper side with respect to semiconductor elements 11 a and 11 b and is connected to the semiconductor element 11 a by the brazing material 16 a. The P main body portion 12 b is disposed laterally of the semiconductor elements 11 a and 11 b, is connected to the P connected portion 12 a, and is thicker than the P connected portion 12 a.

The N main electrode 13, which is a second electrode, is formed of the same conductor as the P main electrode 12, as illustrated in FIG. 2(b), and has an N connected portion 13 a, which is a second connected portion, and an N main body portion 13 b, which is a second main body portion. As illustrated in FIG. 3 , the N connected portion 13 a is disposed on a lower side with respect to the semiconductor elements 11 a and 11 b and is connected to the semiconductor element 11 b by the brazing material 16 b. The N main body portion 13 b is disposed laterally of the semiconductor elements 11 a and 11 b in the same way to the P main body portion 12 b in FIG. 3 , is connected to the N connected portion 13 a, and is thicker than the N connected portion 13 a.

The output terminal 14 is formed of the same conductor as the P main electrode 12, and as illustrated in FIG. 3 , has an output connected portion 14 a, which is a third connected portion, and an output main body portion 14 b, which is a third body portion. The output connected portion 14 a is disposed between the semiconductor elements 11 a and 11 b and is connected to the semiconductor elements 11 a and 11 b by the brazing materials 16 c and 16 d. The output main body portion 14 b is disposed laterally of the semiconductor elements 11 a and 11 b, is connected to the output connected portion 14 a, and is thicker than the output connected portion 14 a.

The sealing member 15, which is a holding member, is formed of, for example, resin, holds the semiconductor elements 11 a and 11 b, the P main electrode 12, the N main electrode 13, and the output terminal 14, and exposes the upper surface of the P main electrode 12 and the lower surface of the N main electrode 13. As illustrated in FIG. 2 , in the first embodiment, the P main body portion 12 b, the N main body portion 13 b, and the output main body portion 14 b are mostly exposed from the sealing member 15.

Here, in FIG. 3 , a thickness of each of the P main body portion 12 b, the N main body portion 13 b, and the output main body portion 14 b is the same as the thickness of the first semiconductor device 1, and is, for example, 3 mm. A thickness of a constituent element on an inner side of the sealing member 15 is reduced by cutting, rolling, or the like, and is, for example, ⅓ or less of the thickness before reduction. Furthermore, here, the thickness corresponds to a length in the vertical direction, and the same applies to the following description.

As a result, each of a thickness of a portion from the P connected portion 12 a to the N connected portion 13 a and a thickness of the sealing member 15 are equal to or less than a thickness of the P main body portion 12 b, a thickness of the N main body portion 13 b, or a thickness of the output main body portion 14 b. As an example of the above configuration, FIG. 3 illustrates a configuration in which there is no difference in level between the upper surfaces of each of the P connected portion 12 a, the P main body portion 12 b, the N main body portion 13 b, the output main body portion 14 b, and the sealing member 15. Similarly, as an example of the above configuration, FIG. 3 illustrates a configuration in which there is no difference in level between the lower surfaces of each of the N connected portion 13 a, the P main body portion 12 b, the N main body portion 13 b, the output main body portion 14 b, and the sealing member 15.

Furthermore, the thickness of the P main body portion 12 b, the thickness of the N main body portion 13 b, and the thickness of the output main body portion 14 b may be different from each other. Even in this case, each of the thickness of the portion from the P connected portion 12 a to the N connected portion 13 a and the thickness of the sealing member 15 may be equal to or less than the thickness of the P main body portion 12 b, the thickness of the N main body portion 13 b, or the thickness of the output main body portion 14 b.

The first semiconductor device 1 according to the first embodiment includes not only the above constituent elements, but also a signal terminal portion 17 of FIG. 2 . The signal terminal portion 17 is connected to the semiconductor elements 11 a and 11 b by a wire (not illustrated) or the like and protrudes outward from a side portion of the sealing member 15.

As illustrated in FIG. 2 , the P main body portion 12 b and the N main body portion 13 b are disposed adjacent to one other in the plan view, and the output main body portion 14 b is disposed on an opposite side to the P main body portion 12 b and the N main body portion 13 b with respect to the sealing member 15 in the plan view. However, a positional relationship between the P main body portion 12 b, the N main body portion 13 b, the output main body portion 14 b, and the signal terminal portion 17 in the plan view is not limited to the positional relationship illustrated in FIG. 2 .

FIG. 5 is a plan view illustrating a configuration of the second semiconductor device 2 according to the first embodiment, FIG. 6 is a cross-sectional view illustrating the configuration, and FIG. 7 is a side view illustrating the configuration. Specifically, FIG. 5(a) is a plan view of the second semiconductor device 2 as viewed from the upper surface, and FIG. 5(b) is a plan view of the second semiconductor device 2 as viewed from the lower surface. FIG. 6 is a cross-sectional view along line D-D of FIG. 5(a). FIG. 7(a) is a side view as viewed from a direction E in FIG. 5(a), and FIG. 7(b) is a side view as viewed from a direction F in FIG. 5(a).

When describing the outline of the configuration of the second semiconductor device 2, the configuration of the second semiconductor device 2 is vertically symmetrical to the configuration of the first semiconductor device 1. Hereinafter, the second semiconductor device 2 will be described in detail.

As illustrated in FIG. 5 , the second semiconductor device 2 includes an N main electrode 22, a P main electrode 23, and a sealing member 25, and as illustrated in FIG. 6 , it includes semiconductor elements 21 a and 21 b, an output terminal 24, and brazing materials 26 a, 26 b, 26 c, and 26 d.

The semiconductor elements 21 a and 21 b are the same as the semiconductor elements 11 a and 11 b, and include at least one of, for example, a semiconductor switching element and a diode of the power semiconductor element. Furthermore, in the first embodiment, the number of semiconductor elements 21 a and 21 b is two, however the present invention is not limited hereto.

The N main electrode 22, which is a first electrode, is formed of the same conductor as the P main electrode 12, and as illustrated in FIG. 5(a), has an N connected portion 22 a, which is a first connected portion, and an N main body portion 22 b, which is a first main body portion. As illustrated in FIG. 6 , the N connected portion 22 a is disposed on an upper side with respect to the semiconductor elements 21 a and 21 b and is connected to the semiconductor element 21 a by the brazing material 26 a. The N main body portion 22 b is disposed laterally of the semiconductor elements 21 a and 21 b in the same way as a P main body portion 23 b in FIG. 6 , is connected to the N connected portion 22 a, and is thicker than the N connected portion 22 a.

The P main electrode 23, which is a second electrode, is formed of the same conductor as the P main electrode 12, and as illustrated in FIG. 5(b), has a P connected portion 23 a, which is a second connected portion, and the P main body portion 23 b, which is a second main body portion. As shown in FIG. 6 , the P connected portion 23 a is disposed on a lower side with respect to the semiconductor elements 21 a and 21 b and is connected to the semiconductor element 21 b by the brazing material 26 b. The P main body portion 23 b is disposed laterally of the semiconductor elements 21 a and 21 b, is connected to the P connected portion 23 a, and is thicker than the P connected portion 23 a.

The output terminal 24 is formed of the same conductor as the P main electrode 12, and as illustrated in FIG. 6 , has an output connected portion 24 a, which is a third connected portion, and an output main body portion 24 b, which is a third body portion. The output connected portion 24 a is disposed between the semiconductor elements 21 a and 21 b and is connected to the semiconductor elements 21 a and 21 b by the brazing materials 26 c and 26 d. The output main body portion 24 b is disposed laterally of the semiconductor elements 21 a and 21 b, is connected to the output connected portion 24 a, and is thicker than the output connected portion 24 a.

The sealing member 25, which is a holding member, is formed of, for example, resin, holds the semiconductor elements 21 a and 21 b, the N main electrode 22, the P main electrode 23, and the output terminal 24, and exposes an upper surface of the N main electrode 22 and a lower surface of the P main electrode 23. As illustrated in FIG. 5 , in the first embodiment, the N main body portion 22 b, the P main body portion 23 b, and the output main body portion 24 b are mostly exposed from the sealing member 25.

Here, in FIG. 6 , a thickness of each of the N main body portion 22 b, the P main body portion 23 b, and the output main body portion 24 b is the same as a thickness of the second semiconductor device 2, and is, for example, 3 mm. A thickness of a constituent element on an inner side of the sealing member 25 is reduced by cutting, rolling, or the like, and is, for example, ⅓ or less of the thickness before reduction.

As a result, each of the thickness of the portion from the N connected portion 22 a to the P connected portion 23 a and the thickness of the sealing member 25 is equal to or less than the thickness of the N main body portion 22 b, the thickness of the P main body portion 23 b, or the thickness of the output main body portion 24 b. As an example of the above configuration, FIG. 6 illustrates a configuration in which there is no difference in level between the upper surfaces of each of the N connected portion 22 a, the N main body portion 22 b, the P main body portion 23 b, the output main body portion 24 b, and the sealing member 25. Similarly, as an example of the above configuration, FIG. 6 illustrates a configuration in which there is no difference in level between the lower surfaces of each of the P connected portion 23 a, the N main body portion 22 b, the P main body portion 23 b, the output main body portion 24 b, and the sealing member 25.

Note that the thickness of the N main body portion 22 b, the thickness of the P main body portion 23 b, and the thickness of the output main body portion 24 b may be different from each other. Even in this case, each of the thickness of the portion from the N connected portion 22 a to the P connected portion 23 a and the thickness of the sealing member 25 may be equal to or less than the thickness of the N main body portion 22 b, the thickness of the P main body portion 23 b, or the thickness of the output main body portion 24 b.

The second semiconductor device 2 according to the first embodiment includes not only the above constituent elements, but also a signal terminal portion 27 of FIG. 5 . The signal terminal portion 27 is connected to the semiconductor elements 21 a and 21 b by a wire (not illustrated) or the like, and protrudes outward from the side portion of the sealing member 25.

As illustrated in FIG. 5 , the N main body portion 22 b and the P main body portion 23 b are disposed adjacent to each other in the plan view, and the output main body portion 24 b is disposed on an opposite side to the N main body portion 22 b and the P main body portion 23 b with respect to the sealing member 25 in the plan view. However, the positional relationship between the N main body portion 22 b, the P main body portion 23 b, the output main body portion 24 b, and the signal terminal portion 27 in the plan view is not limited to the positional relationship illustrated in FIG. 5 .

FIG. 8 is a cross-sectional view illustrating a configuration in which the first semiconductor device 1 and the second semiconductor device 2 according to the first embodiment are bonded, and FIG. 9 is a side view illustrating the configuration. Note that in the following description, when the P main electrodes 12 and 23 and the N main electrodes 13 and 22 are not differentiated from each other, they may be referred to as the “main electrodes”.

The N main electrode 13 of the first semiconductor device 1 and the N main electrode 22 of the second semiconductor device 2 overlap one another in the plan view, and further, are electrically connected by being in direct contact with each other.

A part of the P main electrode 12 of the first semiconductor device 1 and a part of the P main electrode 23 of the second semiconductor device 2 overlap one another in the plan view, and further, are electrically connected by being in direct contact with each other. Here, the part of the P main electrode 12 is the P main body portion 12 b, and the part of the P main electrode 23 is the P main body portion 23 b.

A part of the output terminal 14 of the first semiconductor device 1 and a part of the output terminal 24 of the second semiconductor device 2 overlapped one another in the plan view, and further, are electrically connected by being in direct contact with each other. Here, the part of the output terminal 14 is the output main body portion 14 b, and the part of the output terminal 24 is the output main body portion 24 b.

Two 2-in-1 modules are connected in parallel to realize a 4-in-1 module by the configuration in which the first semiconductor device 1 and the second semiconductor device 2 are bonded as described above. Note that in the first embodiment, the electrode and the output terminal of the first semiconductor device 1 are electrically connected to the electrode and the output terminal of the second semiconductor device 2 by direct contact, however the present invention is not limited hereto. For example, like in a fifth embodiment and the like to be described later, an electrode and an output terminal of the first semiconductor device 1 and an electrode and an output terminal of the second semiconductor device 2 may be electrically connected by a metal plate or the like interposed therebetween.

In addition, while the configuration including one first semiconductor device 1 and one second semiconductor device 2 has been described in the above description, the configuration may include one or more first semiconductor devices 1 and one or more second semiconductor devices 2 in which the first semiconductor device 1 and the second semiconductor device 2 are alternately bonded one by one. For example, as illustrated in FIG. 10 , the configuration may be one in which one second semiconductor device 2 is interposed between two first semiconductor devices 1.

In FIG. 10 , the N main electrode 13, a part of the P main electrode 12, and a part of the output terminal 14 of the uppermost first semiconductor device 1, and the N main electrode 22, a part of the P main electrode 23, and a part of the output terminal 24 of the second semiconductor device 2 each overlap one another in the plan view and further, are electrically connected. Furthermore, the P main electrode 23, a part of the N main electrode 22, and a part of the output terminal 24 of the second semiconductor device 2, and the P main electrode 12, a part of the N main electrode 13, and a part of the output terminal 14 of the lowermost first semiconductor device 1 each overlap one another in the plan view and further, are electrically connected. Accordingly, three 2-in-1 modules are connected in parallel to realize a 6-in-1 module.

Summary of First Embodiment

According to the semiconductor device according to the first embodiment as described above, additional semiconductor elements can be connected in parallel by bonding the first semiconductor device 1 and the second semiconductor device together. Furthermore, since the main electrodes connected to an external unit such as a power supply, a motor, or the like are also bonded, it can cope with an increase in current and an increase in Joule heat following the additional parallel connection, and by making it easy to position (align) and fix the main electrode, ease of assembly is improved. In addition, since the gap between the first semiconductor device 1 and the second semiconductor device 2 that are bonded can be reduced, including that a gap between the main electrodes having the same potential can be reduced, and the like, it is possible to simplify the ease of assembly of the semiconductor device and miniaturize the semiconductor device.

Second Embodiment

FIG. 11 is a cross-sectional view illustrating configurations of the first semiconductor device 1 and the second semiconductor device 2 according to a second embodiment. Hereinafter, portions of the configurations of the second embodiment that differ from the configuration of the first embodiment will mainly be described.

In FIG. 11 , a concave portion 31 a is disposed on at least one of the N main electrode 22 and the P main electrode 23 of the second semiconductor device 2, and a convex portion 32 a fitting with the concave portion 31 a is disposed on at least one of the N main electrode 13 and the P main electrode 12 of the first semiconductor device 1. Furthermore, in FIG. 11 , a concave portion 31 b is disposed in the output terminal 24 of the second semiconductor device 2, and a convex portion 32 b fitting with the concave portion 31 b is disposed on the output terminal 14 of the first semiconductor device 1.

Note that, contrary to the configuration of FIG. 11 , a concave portion may be disposed on at least one of the P main electrode 12 and the N main electrode 13 of the first semiconductor device 1, and a convex portion fitting with the concave portion may be disposed on at least one of the P main electrode 23 and the N main electrode 22 of the second semiconductor device 2. In addition, the above concave portion and convex portion may be a plurality of minute irregularities, or they may have a serrated shape.

According to the semiconductor device according to the second embodiment as described above, it is possible to realize improvement in positioning (alignment) when bonding the first semiconductor device and the second semiconductor device 2 and improvement in heat conductivity due to an increase in a contact area between the main electrodes. In addition, when greases are disposed between the main electrodes, the contact area between the main electrodes and the greases can be increased, therefore heat conductivity can be improved.

Third Embodiment

FIG. 12 is a cross-sectional view illustrating configurations of the first semiconductor device 1 and the second semiconductor device 2 according to a third embodiment. Hereinafter, portions of the configurations of the third embodiment that differ from the configuration of the first embodiment and the second embodiment will mainly be described.

In the third embodiment, a first positioning portion capable of positioning (aligning) the first semiconductor device 1 and the second semiconductor device 2 is disposed in each of the sealing members 15 and 25 of the first semiconductor device 1 and the second semiconductor device 2. The first positioning portion may be, for example, a concave portion and a convex portion as illustrated in FIG. 12 , or it may be a screw hole or a groove (not illustrated). Note that, while in the example of FIG. 12 , the concave portion 33, which is the first positioning portion, is disposed on the sealing member 25, and the convex portion 34, which is the first positioning portion, is disposed on the sealing member 15, the concave portion may be provided on the sealing member 15, and the convex portion may be provided on the sealing member 25.

According to the semiconductor device according to the third embodiment as described above, it is possible to improve positioning (alignment) when bonding the first semiconductor device 1 and the second semiconductor device 2.

Fourth Embodiment

FIG. 13 is a plan view illustrating a configuration of the second semiconductor device 2 according to a fourth embodiment. The second semiconductor device 2 according to the fourth embodiment includes not only the constituent elements described in the first embodiment to the third embodiment, but also a dummy portion 27 a of the signal terminal portion 27.

The dummy portion 27 a protrudes outward from the side portion of the sealing member 25 in the same way as the signal terminal portion 27. Also, the dummy portion 27 a is provided with a second positioning portion capable of positioning (aligning) the first semiconductor device 1 and the second semiconductor device 2. In the example of FIG. 13 , an annular portion 27 b, which is a second positioning portion, is disposed in the dummy portion 27 a of the second semiconductor device 2. Note that, although not illustrated, the first semiconductor device 1 also includes a same dummy portion as the dummy portion 27 a, and an annular portion, which is a second positioning portion, is disposed in the dummy portion.

According to the semiconductor device according to the fourth embodiment as described above, it is possible to improve positioning (alignment) when bonding the first semiconductor device and the second semiconductor device 2.

Fifth Embodiment

In the first embodiment to the fourth embodiment, a metal plate including copper (Cu) may be disposed between the first semiconductor device 1 and the second semiconductor device 2. For example, the metal plate is patterned to maintain an electrical connection between the P main electrodes 12 and 23, an electrical connection between the N main electrodes 13 and 22, and an electrical connection between the output terminals 14 and 24, while maintaining insulation between these three electrical connections. According to such a semiconductor device according to the fifth embodiment, heat dissipation and rigidity can be improved.

Sixth Embodiment

In the fifth embodiment, the metal plate disposed between the first semiconductor device 1 and the second semiconductor device 2 may include molybdenum (Mo) instead of Cu. Note that the metal plate may include Mo by including an Mo alloy. According to such a semiconductor device according to a sixth embodiment, rigidity can be further improved. As a result, deformation of the semiconductor device due to heat can be suppressed, therefore reliability of the semiconductor device can be improved.

Seventh Embodiment

Between the first semiconductor device 1 and the second semiconductor device 2 of the first embodiment to the fourth embodiment, a sheet including resin or carbon having higher heat dissipation than the sealing members 15 and 25 may be disposed, greases may be disposed, or the first semiconductor device 1 and the second semiconductor device 2 may be brazed. According to such a configuration, adhesion and heat dissipation can be improved.

Eighth Embodiment

In the first embodiment to the seventh embodiment, the insulating plates 70 a and 70 b in FIG. 1 may be sheet-like resin insulating plates. According to such a configuration, it is possible to suppress chinks and cracks generated when the insulating plates 70 a and 70 b are made of ceramic resin, therefore reliability of thermal conduction can be improved.

Ninth Embodiment

FIG. 14 is a cross-sectional view illustrating a configuration of a semiconductor device according to a ninth embodiment. Hereinafter, portions of the configuration of the ninth embodiment that differ from the configuration of the first embodiment to the eighth embodiment will mainly be described.

The semiconductor device according to the ninth embodiment includes circuit boards 72 a and 72 b.

The circuit board 72 a is disposed on the upper surface of the first semiconductor device 1 and the second semiconductor device 2 that are bonded (hereinafter also referred to as a “device bonding structure”). The circuit board 72 a includes the insulating plate 70 a and a metal plate 71 a, and the metal plate 71 a is disposed between the insulating plate 70 a and the device bonding structure.

Similarly, the circuit board 72 b is disposed on the lower surface of the device bonding structure. The circuit board 72 b includes the insulating plate 70 b and a metal plate 71 b, and the metal plate 71 b is disposed between the insulating plate 70 b and the device bonding structure.

According to such a configuration of the semiconductor device according to the ninth embodiment, not only can the grease between the insulating plates 70 a and 70 b and the device bonding structure be omitted, but heat dissipation can also be improved.

Tenth Embodiment

FIG. 15 is a cross-sectional view illustrating a configuration of the semiconductor device according to the tenth embodiment. Hereinafter, portions of the configuration of the tenth embodiment that differ from the configuration of the first embodiment to the ninth embodiment will mainly be described.

The semiconductor device according to the tenth embodiment includes a finned circuit board 74 a.

The finned circuit board 74 a is disposed on an upper surface of the device bonding structure. The finned circuit board 74 a includes the same insulating plate 70 a and the metal plate 71 a as those in the configuration of the ninth embodiment (FIG. 14 ), and it also includes a fin board 73 a disposed on an opposite side to the metal plate 71 a with respect to the insulating plate 70 a. The cooling fin 80 a is combined with the finned circuit board 74 a via a sealing component 81 a such as an O-ring, for example.

According to such a configuration of the semiconductor device according to the tenth embodiment, heat dissipation can be improved. Note that, while not illustrated in FIG. 15 , the same configuration as the finned circuit board 74 a, the cooling fin 80 a, and the sealing component 81 a may be applied to a lower configuration of the device bonding structure.

Eleventh Embodiment

In the first embodiment to the tenth embodiment, at least one of the semiconductor elements 11 a, 11 b, 21 a, and 21 b may include silicon carbide (SiC) or gallium nitride (GaN). According to such a configuration, miniaturization and high efficiency of the semiconductor device can be realized.

Twelfth Embodiment

In the first embodiment to the eleventh embodiment, when the first semiconductor device 1 is disposed on the second semiconductor device 2 such as in FIG. 8 , the N main electrode 22 of the second semiconductor device 2 and the N main electrode 13 of the first semiconductor device 1 may be integrated by welding. Contrary to this case, when the second semiconductor device 2 is disposed on the first semiconductor device 1, the P main electrode 12 of the first semiconductor device 1 and the P main electrode 23 of the second semiconductor device 2 may be integrated by welding. According to such a configuration, since a screw or the like for screwing is unnecessary, the number of components required for the semiconductor device can be reduced.

Thirteenth Embodiment

FIG. 16 is a cross-sectional view illustrating a configuration of the first semiconductor device 1 according to a thirteenth embodiment, and FIG. 17 is a plan view illustrating the configuration. In FIG. 16 , the semiconductor element and the like are not illustrated for convenience. FIG. 17(a) is a plan view of the first semiconductor device 1 as viewed from the upper surface, and FIG. 17(b) is a plan view of the first semiconductor device 1 as viewed from the lower surface. Hereinafter, portions of the configuration of the thirteenth embodiment that differ from the configurations of the first embodiment to the twelfth embodiment will mainly be described.

In the thirteenth embodiment, a through hole 86 a extending in the vertical direction is provided in the sealing member 15 of the first semiconductor device 1. In addition, a shape of the through hole 86 a in the plan view is not limited to a quadrangle shape as is illustrated in FIG. 17 , and may be, for example, another polygon shape, or it may be a circle.

Such a semiconductor device according to the thirteenth embodiment can improve heat dissipation. Note that, in the above description, the sealing member 15 of the first semiconductor device 1 has been provided with the through hole 86 a extending in the vertical direction, but the present invention is not limited hereto. For example, a through hole extending in the vertical direction may be provided in at least one of the sealing member 15 of the first semiconductor device 1 and the sealing members 15 and 25 of the second semiconductor device 2.

Fourteenth Embodiment

FIG. 18 is a cross-sectional view illustrating a configuration of the semiconductor device according to the fourteenth embodiment. In FIG. 18 , the semiconductor element and the like are not illustrated for convenience, as in FIG. 16 . Hereinafter, portions of the configuration of the fourteenth embodiment that differ from the configuration of the thirteenth embodiment will mainly be described.

Similarly to the thirteenth embodiment, in the fourteenth embodiment, the sealing member 15 of the first semiconductor device 1 is provided with the through hole 86 a extending in the vertical direction. Furthermore, the sealing member 25 of the second semiconductor device 2 is also provided with a through hole 86 b extending in the vertical direction.

Moreover, the semiconductor device according to the fourteenth embodiment includes a fitting member 87 fitting with the through hole 86 a of the first semiconductor device 1 and the through hole 86 b of the second semiconductor device 2. The fitting member 87 may be a metal member having an insulation treated surface, or it may be an insulating member. According to such a configuration, it is possible to improve positioning (alignment) when bonding the first semiconductor device and the second semiconductor device 2.

Furthermore, as illustrated in FIG. 18 , the fitting member 87 may be capable of being fastened to the cooling fins 80 a and 80 b, or it may be integrated therewith. According to such a configuration, when the fitting member 87 is a metal member having an insulation treated surface or the like, heat dissipation can be improved.

Fifteenth Embodiment

FIG. 19 is a cross-sectional view illustrating a configuration of a semiconductor device according to the fifteenth embodiment. In FIG. 19 , the semiconductor element and the like are not illustrated for convenience, as in FIG. 16 . Hereinafter, portions of the configuration of the fifteenth embodiment that differ from the configuration of the fourteenth embodiment will mainly be described.

In the fifteenth embodiment, a space 87 a through which a refrigerant such as cooling water or the like passes is provided inside the fitting member 87. For example, an insulating pipe or the like is used as such a fitting member 87. In FIG. 19 , an example of a travel direction of the refrigerant is illustrated by an arrow. According to such a configuration, heat dissipation can be improved. Note that, as illustrated in FIG. 19 , the cooling fins 80 a and 80 b may be provided with spaces 80 c and 80 d that connect with the space 87 a of the fitting member 87 and through which refrigerant passes.

Note that each embodiment can be freely combined with each modification example, and each embodiment and each modification example can be modified or omitted as appropriate.

The above description is intended to be illustrative and not restrictive in all aspects. It is understood that numerous modification examples not illustrated are possible.

EXPLANATION OF REFERENCE SIGNS

-   -   1: first semiconductor device     -   2: second semiconductor device     -   11 a, 11 b, 21 a, 21 b: semiconductor element     -   12, 23: P main electrode     -   12 a, 23 a: P connected portion     -   12 b, 23 b: P main body portion     -   13, 22: N main electrode     -   13 a, 22 a: N connected portion     -   13 b, 22 b: N main body portion     -   14, 24: output terminal     -   14 a, 24 a: output connected portion     -   14 b, 24 b: output main body portion     -   15, 25: sealing member     -   27: signal terminal portion     -   27 a: dummy portion     -   27 b: annular portion     -   31 a, 33: concave portion     -   32 a, 34: convex portion     -   60 a, 60 c: grease     -   70 a, 70 b: insulating plate     -   71 a, 71 b: metal plate     -   72 a, 72 b: circuit board     -   73 a: finned circuit board     -   80 a, 80 b: cooling fin     -   81 a: sealing component     -   86 a, 86 b: through hole     -   87: fitting member     -   87 a: space 

1. A semiconductor device comprising a first semiconductor device and a second semiconductor device capable of being bonded, wherein each of the first semiconductor device and the second semiconductor device includes a semiconductor element, a first electrode having a first connected portion disposed on a first side in a vertical direction, which is a bonding direction of the first semiconductor device and the second semiconductor device, with respect to the semiconductor element, and connected to the semiconductor element, and a first main body portion disposed laterally of the semiconductor element and connected to the first connected portion, a second electrode having a second connected portion disposed on a second side in the vertical direction with respect to the semiconductor element and connected to the semiconductor element, and a second main body portion disposed laterally of the semiconductor element and connected to the second connected portion, and a holding member that holds the semiconductor element, the first electrode, and the second electrode, and exposes a surface of the first electrode on the first side and a surface of the second electrode on the second side, at least one of a pair of the first electrode of the first semiconductor device and the second electrode of the second semiconductor device, and a pair of the second electrode of the first semiconductor device and the first electrode of the second semiconductor device is electrically connected, and for each of the first semiconductor device and the second semiconductor device, each of a thickness of a portion from the first connected portion to the second connected portion and a thickness of the holding member are equal to or less than a thickness of the first main body portion or a thickness of the second main body portion.
 2. The semiconductor device according to claim 1, wherein each of the first semiconductor device and the second semiconductor device further includes an output terminal having a third connected portion connected to the semiconductor element and a third main body portion disposed laterally of the semiconductor element and connected to the third connected portion, the output terminal of the first semiconductor device and the output terminal of the second semiconductor device are electrically connected, and for each of the first semiconductor device and the second semiconductor device, each of a thickness of a portion from the first connected portion to the second connected portion and a thickness of the holding member are equal to or less than a thickness of the first main body portion, a thickness of the second main body portion, or a thickness of the third main body portion.
 3. The semiconductor device according to claim 2, wherein for each of the first semiconductor device and the second semiconductor device, there is no difference in level between surfaces of each of the first connected portion, the first main body portion, the second main body portion, the third main body portion, and the holding member on the first side, and there is no difference in level between surfaces of each of the second connected portion, the first main body portion, the second main body portion, the third main body portion, and the holding member on the second side.
 4. The semiconductor device according to claim 1, wherein a concave portion is provided on at least one of the first electrode and the second electrode of one of the first semiconductor device and the second semiconductor device, and a convex portion fitting with the concave portion is provided on at least one of the first electrode and the second electrode of the other of the first semiconductor device and the second semiconductor device.
 5. The semiconductor device according to claim 1, wherein a first positioning portion capable of positioning the first semiconductor device and the second semiconductor device is disposed on the holding member of each of the first semiconductor device and the second semiconductor device.
 6. The semiconductor device according to claim 1, wherein each of the first semiconductor device and the second semiconductor device further includes a dummy portion of a signal terminal portion that protrudes outward from a side portion of the holding member, and a second positioning portion capable of positioning the first semiconductor device and the second semiconductor device is disposed on the dummy portion of each of the first semiconductor device and the second semiconductor device.
 7. The semiconductor device according to claim 1, wherein a metal plate is disposed between the first semiconductor device and the second semiconductor device.
 8. The semiconductor device according to claim 7, wherein the metal plate includes Cu or Mo.
 9. The semiconductor device according to claim 1, wherein between the first semiconductor device and the second semiconductor device, a sheet including resin or carbon having higher heat dissipation than the holding member is disposed, or a grease is disposed, or the first semiconductor device and the second semiconductor device are brazed.
 10. The semiconductor device according to claim 1, further comprising a sheet-like resin insulating plate disposed on at least one of a surface on the first side and a surface on the second side of the first semiconductor device and the second semiconductor device that are bonded, via grease.
 11. The semiconductor device according to claim 1, further comprising a circuit board including an insulating plate and a metal plate and disposed on at least one of a surface on the first side and a surface on the second side of the first semiconductor device and the second semiconductor device that are bonded.
 12. The semiconductor device according to claim 1, further comprising: a finned circuit board disposed on at least one of a surface on the first side and a surface on the second side of the first semiconductor device and the second semiconductor device that are bonded; and a cooling fin combined with the finned circuit board via a sealing component.
 13. The semiconductor device according to claim 1, wherein the semiconductor element includes SiC or GaN.
 14. The semiconductor device according to claim 1, wherein at least one of a pair of the first electrode of the first semiconductor device and the second electrode of the second semiconductor device, and a pair of the second electrode of the first semiconductor device and the first electrode of the second semiconductor device is integrated by welding.
 15. The semiconductor device according to claim 1, wherein a through hole extending in the vertical direction is provided on at least one of the holding member of the first semiconductor device and the holding member of the second semiconductor device.
 16. The semiconductor device according to claim 15, wherein the through hole is provided on each of the holding member of the first semiconductor device and the holding member of the second semiconductor device, and the semiconductor device further comprises a fitting member fitting with the through hole of the first semiconductor device and the through hole of the second semiconductor device.
 17. The semiconductor device according to claim 16, wherein a space through which refrigerant passes is provided inside the fitting member. 